# Bambu X1 Carbon profile notes

These notes target a Bambu X1 Carbon with the stock 0.4 mm hardened nozzle and commodity PETG or ASA. The enclosure should be printed in non-conductive material because the Pi Zero 2 W Wi-Fi/BLE antenna and optional PN532 NFC antenna sit inside the shell.

## Material

Recommended:

- PETG for easiest enclosed-electronics printing and moderate heat resistance.
- ASA when the device may sit in warmer environments or direct light, provided ventilation and fume handling are appropriate.

Avoid:

- Carbon-filled, metal-filled, conductive, or ESD filaments near the NFC/Wi-Fi regions. Fillers can detune antennas, reduce NFC read range, and add unpredictable RF loss around the Pi Zero 2 W radio and PN532 coil.
- PLA for unattended warm enclosures; it can soften or creep around screw bosses and cable strain relief.

## Orientation

- Base tub: print open-side up. This keeps the floor flat on the bed, leaves the Pi standoffs vertical, and avoids support in the electronics cavity.
- Lid: print exterior/top face up when preserving outside finish matters; print exterior face down on a textured plate when a textured top is desired. Inspect the OLED and button openings after slicing.
- Cable clamp: print flat on its broad face.
- Button plungers: print caps up with the small stem on the plate, or use a brim if the stems are unstable on your plate.
- NFC blank: print flat.

## Layer and shell settings

Suggested starting profile:

- Nozzle: 0.4 mm hardened steel.
- Layer height: 0.20 mm for general prints; 0.16 mm for cleaner button and OLED edges.
- Wall loops: 4 for base and lid; 3 is acceptable for first fit checks.
- Top/bottom shells: 5 top, 5 bottom.
- Infill: 15-25% gyroid or grid. Higher infill is not usually useful; wall count matters more for bosses and slots.
- Seam: rear or nearest rear connector side, so the front NFC/OLED area stays clean.
- Elephant foot compensation: enable if your plate/material profile supports it; connector slots and lid lip fit are sensitive to first-layer swell.

## Supports

- Base tub: no supports expected when printed open-side up. The rear connector openings and side vents are short bridges.
- Lid: no supports expected for the OLED window and button holes; inspect the nested lip in preview.
- Cable clamp: no supports expected.
- Buttons: no supports expected; use brim only for bed adhesion.
- If Bambu Studio proposes dense support inside the enclosure, re-check orientation before accepting it.

## PETG starting points

Use a calibrated Bambu PETG profile as the base, then inspect fit:

- Bed: textured PEI or engineering plate appropriate for your PETG.
- Cooling: moderate, not maximum; avoid brittle layer bonding around standoffs.
- Speed: normal profile is fine for fit prototypes; slow outer walls if cosmetic quality matters.
- Tolerance: if the lid is tight, increase `fit_clearance` in the OpenSCAD file by 0.1-0.2 mm rather than sanding every print.

## ASA starting points

Use a calibrated ASA profile and keep the chamber stable:

- Enclosure/chamber: closed and pre-warmed if your workflow supports it.
- Bed adhesion: brim recommended for base and lid if corners lift.
- Cooling: low-to-moderate to reduce warping.
- Ventilation: follow ASA fume handling practices.
- Let the part cool gradually before removal to reduce corner stress.

## Inspection before assembly

After slicing, inspect these areas in layer preview:

- Pi standoff bores and heat-set insert bosses.
- OLED window perimeter and button holes.
- Rear USB/HDMI/power connector slots.
- Cable clamp channel.
- Optional PN532 bay and lid NFC read land.
- Lid lip clearance against the base tub walls.

The hardware enclosure increases physical custody and witness assurance for a local appliance. It is not a tamper-proof enclosure and does not prove provider deletion, model forgetting, truth of memories, or absence of all side channels.